We specialize in surface mount and other state of the art assembly technologies such as BGA (Ball Grid Array),Micro BGA,CSP (Chip Scale Packages),and FC (Flip Chip). Our documented quality system ensures the construction of high quality products and most of all compliance with the specific requirements of our customers. We are quite knowledgeable in post assembly testing,engineering and prototyping,and rework and repair. Our expertise and comprehensive experience base translates into lower costs and quicker turnaround to our customers.